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ALD Equipment Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

ALD Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ハイテック・システムズ Kanagawa//Industrial Machinery
  2. Creative Coatings Co., Ltd. Tokyo//Electronic Components and Semiconductors
  3. ティー・ケイ・エス Tokyo//Electronic Components and Semiconductors
  4. マツボー Tokyo//Trading company/Wholesale
  5. 5 サムコ Kyoto//Industrial Machinery
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ALD Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Ultra-low temperature ALD device CMVA-1000 for TGV (maximum 600 corners) Creative Coatings Co., Ltd.
  2. High-speed film-forming ALD device 'FHR.STAR-400x300SALD' ティー・ケイ・エス
  3. Particle ALD (Atomic Layer Deposition) device / FORGE NANO Inc. マツボー
  4. 4 Large substrate ALD device ハイテック・システムズ
  5. 4 Thermal ALD equipment "Savannah G2" ハイテック・システムズ

ALD Equipment Product List

1～15 item / All 17 items

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ALD (Atomic Layer Deposition) device

ALD (Atomic Layer Deposition) device

Reduction of maintenance load and compactization of volume achieved by a double-structured chamber. Our thermal solutions are consolidated to achieve optimal temperature management.

Equipment for experiments and research and development provided by Watty. We offer devices ranging from 2-inch to 8-inch models to meet user needs. Additionally, we provide various optional ancillary equipment to reduce the burden of equipment installation for our customers. We can accommodate customization requests for all aspects, including safety specifications, the number of precursors, precursor introduction methods, and exhaust systems. *For more details, please refer to the PDF materials or feel free to contact us. ▼ Contact Information TEL: Sagamihara Office 042-704-5352 MAIL: info@watty.co.jp

  • Processing Contract
  • Other surface treatment equipment

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Large substrate ALD device

Large substrate ALD device

We will deposit films on 4.5 generation and 5.5 generation corner substrates.

High-Tech Systems is the sales agent for Veeco/CNT, a global leading company in Atomic Layer Deposition (ALD) equipment. Veeco/CNT is the ALD division of the American company Veeco, which develops advanced ALD technology and is the manufacturer of the most widely used development and pilot production ALD equipment in research institutions, universities, and companies around the world. They also have a proven track record in the market for production ALD equipment and large-area substrate ALD equipment, and they respond to customer requests.

  • Other processing machines

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Thermal ALD equipment "Savannah G2"

Thermal ALD equipment "Savannah G2"

For research and development, for small-scale batches! Standard equipped with a simple decontamination unit ALD Shield Vapor Trap.

The "Savannah G2" is a flexible thermal ALD device that is simple and easy to use, capable of supporting everything from research and development to small-scale mass production. It achieves high film deposition performance with a simple system, and configurations can be selected according to applications and budgets. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieves high film deposition performance with a simple system ■ Ultra-high aspect ratio (less than 2000:1) compatible mode ■ Configuration selection based on applications and budgets ■ Precursor lines: up to 6 lines ■ Simple exhaust unit: ALD Shield Vapor Trap standard equipped * For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Plasma/Thermal ALD equipment 'Fiji G2'

Plasma/Thermal ALD equipment 'Fiji G2'

500℃ wafer stage! Adoption of a remote ICP source with no plasma damage.

The "Fiji G2" is a research and development ALD system that utilizes thermal and plasma methods. It employs an ICP remote plasma source and features a vacuum load lock for substrate transport, designed to produce high-quality ALD films of oxide, nitride, and metal layers. Additionally, it comes standard with a simple exhaust unit, the ALD Shield Vapor Trap, and can accommodate up to 6 plasma gas lines. 【Features】 ■ 500°C wafer stage ■ Remote ICP source with no plasma damage ■ Mode supporting ultra-high aspect ratios (<2000:1) (thermal) ■ Plasma gas lines: up to 6 lines ■ Precursor lines: up to 6 lines *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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DLI-CVD/DLI-ALD device "MC-050"

DLI-CVD/DLI-ALD device "MC-050"

Due to lamp heating, RTP and RTCVD processing is possible! Quartz tube-type chamber.

The MC-050 is a DLI-CVD/DLI-ALD system compatible with substrates up to 50mm in diameter. The maximum film formation temperature is 1100°C (lamp heating method), and it can accommodate up to 6 DLI evaporators. Additionally, it can have a maximum of 8 mass flow controllers and is equipped with a turbo pump. Please feel free to contact us for inquiries. 【Features】 ■ Compatible with substrates up to 50mm in diameter ■ Maximum film formation temperature: 1100°C (lamp heating method) ■ Can accommodate up to 6 DLI evaporators ■ Mass flow controllers: up to 8 ■ Quartz tube-type chamber *For more details, please refer to the PDF document or feel free to contact us.

  • Annealing furnace

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Ultra-low temperature ALD device CMVA-1000 for TGV (maximum 600 corners)

Ultra-low temperature ALD device CMVA-1000 for TGV (maximum 600 corners)

Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).

【Features】 - OH radical oxidation using bubbling H2O/Ar and High Density Plasma - Dense and well-covered film formation; capable of forming dense, homogeneous films with uniform thickness - Compatible with most metal oxide films - Excellent adhesion on any substrate (material, flatness, shape, etc.) - Control of film thickness according to application - Film formation possible at room temperature 【Application Examples】 - Capable of large area applications - TGV/moisture-proof films 【Consultation for Film Formation and Test Coating Available】 At Creative Coatings, we accept requests for test coatings and sample creation. We can listen to your needs and suggest suitable equipment, types of films, and film thicknesses. Please feel free to consult with us. ++++++++++++++++++++++++++++++ We provide next-generation vapor phase technology demanded by the times and environment. We contribute to technological innovation with our dual technology of low-temperature (room temperature) ALD equipment for semiconductors and powder low-temperature (room temperature) ALD film formation equipment.

  • Other semiconductor manufacturing equipment
  • Plasma surface treatment equipment
  • Surface treatment contract service

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High-speed film-forming ALD device 'FHR.STAR-400x300SALD'

High-speed film-forming ALD device 'FHR.STAR-400x300SALD'

Compatible with in-situ ellipsometers and transmission spectrometers! High-speed ALD equipment manufactured by the German company FHR.

The "FHR.STAR-400x300SALD" is a high-speed deposition ALD (Spatial ALD) system designed for film deposition on substrates and textiles ranging from 200mm wafers to 400x300mm. It enables uniform film deposition on three-dimensional shapes up to 10mm thick for 400x300 substrates. Due to its faster deposition compared to conventional thermal ALD methods, it can be used for mass production of devices and is designed to accommodate in-situ ellipsometers and transmission spectrometers, allowing for more precise process control. With a cluster-compatible design, it can integrate transport chambers, load locks, and other process chambers as needed. We also offer equipment compatible with small-diameter wafers, so please inquire for more information. 【Features】 ■ Uniform film deposition on three-dimensional shapes up to 10mm thick (for 400x300 substrates) ■ Faster deposition compared to conventional thermal ALD methods ■ Usable for mass production of devices *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Other semiconductor manufacturing equipment

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ALD device Beneq TFS 200

ALD device Beneq TFS 200

ALD equipment for research and development that grows together.

The "Beneq TFS 200" is a highly flexible ALD research platform suitable for academic research and corporate R&D. It is specially designed to minimize cross-contamination that can occur in multi-user research environments. Additionally, it provides technological solutions that enable high-quality film deposition on wafers, flat objects, particles, porous bulk materials, and complex three-dimensional objects characterized by very high aspect ratios. 【Products Offered (Partial)】 ■ 3D and batch production ■ Research equipment ■ Semiconductor devices ■ Spatial ALD devices *For more details, please download the PDF or feel free to contact us.

  • Company：Beneq
  • Price：Other
  • Other inspection equipment and devices
  • Other semiconductor manufacturing equipment

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ALD device Beneq TFS 500

ALD device Beneq TFS 500

Platform for ALD research and batch production.

The "Beneq TFS 500" is suitable for various applications in thin film deposition and is an ideal tool for multi-project environments. Equipped with a manual load lock, it enhances wafer processing capabilities. Different types of reaction chambers can be installed inside the vacuum chamber, allowing each reaction chamber to be optimized according to the customer's needs. Additionally, it can meet both the stringent requirements for industrial reliability and the need for flexibility in R&D operations. The process components ensure the availability of spare parts. 【Products and Services Offered】 ■ 3D and batch production ■ Research equipment ■ Coating services ■ Research and development services *For more details, please download the PDF or feel free to contact us.

  • Company：Beneq
  • Price：Other
  • Other inspection equipment and devices
  • Other semiconductor manufacturing equipment

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Load-lock type plasma ALD system "AD-230LP"

Load-lock type plasma ALD system "AD-230LP"

Alternately supply organometallic materials and oxidants to the reaction chamber, and film formation occurs only through surface reactions.

The "AD-230LP" is an ALD device capable of atomic-level film thickness control. It supplies organic metal precursors and oxidizers alternately to the reaction chamber, forming a film solely through surface reactions. With a load-lock chamber, it does not expose the reaction chamber to the atmosphere, allowing for highly reproducible film formation. Additionally, by adopting a capacitively coupled plasma (CCP) method, it minimizes the volume of the reaction chamber, shortens gas purge times, and accelerates each cycle. 【Features】 - Conformal film formation at the top, middle, and bottom - Uniform layer control at the atomic monolayer level - Conformal film formation possible for high aspect ratio structures - Excellent in-plane uniformity and reproducibility, achieving a stable process - Unique reaction chamber structure suppresses particles *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Plasma/Thermal Dual-Use ALD Equipment

Plasma/Thermal Dual-Use ALD Equipment

Both plasma and thermal ALD film deposition are possible.

High Tech Systems is the sales agent for Veeco/CNT, a global leading company in ALD (Atomic Layer Deposition) equipment. Veeco/CNT is the ALD (Atomic Layer Deposition) division of the US-based Veeco company, engaged in advanced ALD technology development, and is the manufacturer of the most widely used development and pilot production ALD equipment in research institutions, universities, and companies worldwide. They also have a proven track record in the market for production ALD equipment and large-area substrate ALD equipment, and they respond to customer requests.

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Batch-type ALD equipment for mass production

Batch-type ALD equipment for mass production

Batch equipment can simultaneously deposit films on multiple cassettes, enabling large 3D substrate film deposition.

High Tech Systems is the sales agent for Veeco/CNT, a global leading company in Atomic Layer Deposition (ALD) equipment. Veeco/CNT is the ALD division of the U.S. company Veeco, which develops cutting-edge ALD technology and is the manufacturer of the most widely used development and pilot production ALD equipment in research institutions, universities, and companies worldwide. They also have a proven track record in the market for production ALD equipment and large-area substrate ALD equipment, and they respond to customer requests.

  • Other processing machines

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Thermal ALD equipment "Phoenix G2"

Thermal ALD equipment "Phoenix G2"

Many safety measures specifications necessary for mass production! Compact device size with a film formation temperature of 50 to 285°C.

The "Phoenix G2" is a thermal ALD system suitable for medium-scale production. It features a reactor design proven to provide excellent process flexibility, making it easy to use for various applications. Additionally, it supports semi-auto loaders or vacuum load locks and has an appropriate chamber size (less than 370mm x 470mm). 【Features】 ■ Reactor design proven to provide excellent process flexibility ■ Easy to use for various applications ■ Many safety measures required for mass production ■ Compatible with semi-auto loaders or vacuum load locks ■ Appropriate chamber size: less than 370mm x 470mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Thermal ALD equipment "Firebird"

Thermal ALD equipment "Firebird"

Top-class throughput! Flexible modular design.

The "Firebird" is a thermal ALD device of the cluster tool type for large-scale mass production. It is equipped with Veeco's proven automation system, ensuring batch transport with minimal impact on the substrates. Please feel free to consult us when you need assistance. 【Features】 ■ Top-class throughput ■ Low ownership cost ■ Proven Veeco automation system ■ Flexible modular design ■ Batch transport with minimal impact on substrates ■ Veeco's global sales, service, and support *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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DLI-CVD/DLI-ALD device "MC-100/MC-200"

DLI-CVD/DLI-ALD device "MC-100/MC-200"

The maximum film-forming temperature is 800°C! It can accommodate up to 4x DLI evaporators with the chamber heating mechanism.

The "MC-100/MC-200" is a DLI-CVD/DLI-ALD system with a stainless steel chamber. It supports substrates up to 200mm in diameter, with a maximum of 8 mass flow controllers for the "MC-100" and 6 for the "MC-200," and it can be equipped with a turbo pump. Please feel free to consult us when you need assistance. 【Features】 ■ Supports substrates up to 200mm in diameter ■ Maximum film deposition temperature: 800℃ ■ Capable of accommodating up to 4x DLI evaporators ■ Mass flow controllers: up to 8 ■ Stainless steel chamber *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment

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